辅助络合剂对无氰电镀银镀层的影响%Effect of Auxiliary Complexing Agent on the Coating of Cyanide-free Silver Plating
郑州炜盛电子科技有限公司,河南 郑州,450001 河南省科学院 化学研究所有限公司,河南 郑州,450002
2017-06-21
甲基磺酸 无氰电镀银 络合剂 镀层
甲基磺酸盐电镀银工艺是现代无氰电镀银研究的一种重要方法.主要研究了以甲基磺酸和硝酸银为主盐的体系时,添加辅助络合剂对镀层物相的影响.结果表明:加入辅助络合剂可以有效地提高电流效率,且镀层表面无杂相,在该体系中最佳电流密度0.2 A/dm2,Ag+浓度为0.18 mol/L.%Methanesulfonate silver plating is an important method for the research of modern cyanide-free silver plating. The effects of adding auxiliary complexing agent on the phase of the coating are studied using methanesulfonic acid and silver nitrate as the main salt. The results show that the addition of auxiliary complexing agent can effectively improve the current efficiency,and the surface of the coating is no hybrids,in the system the best current density is 0. 2A/dm~2,and the concentration of Ag~+ is 0. 18 mol/L.
